Nautilus Defense first to demonstrate direct die attach of chiplets to 2D textile networks at a 180 micron pitch

Nautilus Defense announced that it has successfully demonstrated the world's first direct die attach of chiplets to embroidered conductive yarns at a 180µm pitch, a space between yarns that is as thin as a single hair. This technological milestone is an important step toward the scalable manufacture of leading-edge sensor systems that look and feel like the fabrics people wear every day.

Nautilus, through its participation in IARPA's Smart Electrically Powered and Networked Textile Systems (SMART ePANTS) initiative, is developing novel textile-electronics integration technologies that will enable the development and domestic manufacture of innovative products for national defense, medical, aerospace, and other applications.